SERVICES

 

High Temp Packaging
Options

Wafer Dicing

ServicesIC Assembly Services

What’s News?

Semi-Pac is proud to introduce it’s New 300MM capabilityincluding:

  • 100% saw through on film frames.
  • High pressure D.I. water non contact cleaning.
  • Multi die sizes, exact square die, 1u step resolutions.

    • Phone:
    (408) 734 – 3832

    Fax:
    (408) 734 – 9217

    semipac@aol.com

     

     

    Assembly Services Up To 300MM

    Wafer Dicing Services 300MM

    Quick Turn Wafer Sawing

    High Temperature Packaging Options

     

     

    High Temperature Packaging Options

    Semi-Pac Inc. Offers Package Alternatives to the Traditional Side Brazed Hermetic.

    Semi-Pac Inc. Offers AU Plating to Insure Dut Board Insertion Contact Resistance.

    Semi-Pac Inc. Offers Non-Lid Sealed Assemblies for Easy Circuit Access.

    Semi-Pac Inc. Offers High-Temp Marking for Longer High Temperature Exposure.

     

    Side Brazed Std Plating > 375C

    Flat Pack Au Lead > 400C

    Cerdip Select Plate > 400C

    Open Cavity Plastic > 175C

     

     

    ISO 9001:2000 Certified Quality Management System
    Premium Member of the Better Business Bureau

     

     

    To top of the page