SERVICES

 

High Temp Packaging
Options

Wafer Dicing

ServicesIC Assembly Services

What’s News?

Semi-Pac is proud to introduce it’s New 300MM capabilityincluding:

  • 100% saw through on film frames.
  • High pressure D.I. water non contact cleaning.
  • Multi die sizes, exact square die, 1u step resolutions.

    • Phone:
    (408) 734 – 3832

    Fax:
    (408) 734 – 9217

    semipac@aol.com

     

     

    Assembly Services Up To 300MM

    Wafer Dicing Services 300MM

    Quick Turn Wafer Sawing

    High Temperature Packaging Options

     

    Quick Turn Wafer Sawing

     

    Specializing in Quick Turn Wafer Sawing Services.

    Semi-Pac-Inc. has provided Excellent Wafer Saw Service for over 18 Years in the Heart of Silicon Valley.

    Sem-Pac-Inc. can meet your requirements no matter how demanding:

    * Low K Materials

    * Multiple Die Sizes

    * Bumped Wafers CSP/FLIPCHIP

    * Engineered Materials

     

    SEMI-PAC OFFERS EXCELLENT CUTTING PERFORMANCE

     

    Example of Wafer Saw Backside Exit Quality

     

    Multiple Die Size Cutting / Test Tile Retreival

     

    ISO 9001:2000 Certified Quality Management System
    Premium Member of the Better Business Bureau

     

     

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