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What’s News?

Semi-Pac is proud to introduce it’s New 300MM capability including:

  • 100% saw through on film frames.
  • High pressure D.I. water non contact cleaning.
  • Multi die sizes, exact square die, 1u step resolutions.

    • Phone:
    (408) 734 – 3832

    Fax:
    (408) 734 – 9217

    semipac@aol.com

     

    Semi-Pac Inc. has a strategic partnership with Spheretek LLC which offers a patented low cost Wafer Bumping Technology.

    Spheretek's Wafer Bumping Technology is a unique process that can be incorporated on a wide range of applications, such as:

    Ball Grid Arrays (BGA)

    Chip Scale Packages (CSP)

    Wafers

    All incorporated into the same Machine Format.