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Semi-Pac is proud to introduce it’s New 300MM capability including:
Phone:
(408) 734 – 3832
Fax:
(408) 734 – 9217
semipac@aol.com
Semi-Pac Inc. was founded in 1988 to provide cost effective Semiconductor Packaging Solutions to the electronic industry. Semi-Pac Inc. is located in Sunnyvale, California in the heart of Silicon Valley and ships both domestic and internationally. One of our biggest strengths is our relationships within the engineering community.
Semi-Pac Inc. focuses on serving the electronic industry with Semiconductor Assembly Services as well as package and process development. Our expertise is in but not limited to Semiconductor Assembly Services for all types of packages, Sidebraze, Chip carriers, LCC's leadless Chip carriers, QFP's Quad flat packs, Multichip Modules, Hybrids, Including Low K Materials.
Wafer Dicing Services up to 300MM wafers Including Low K Materials.
Thomas E Molinaro -
Founder and President, Semi-Pac. Inc.
Twenty Eight years in the Semiconductor Packaging industry. Main duties include manufacturing engineering for both the Commercial and Military component markets.
Previously held positions at Digital Equipment Corporation, Intel Corporation, Precision Monolithics, Data Linear, and Sipex Corporation.
Work experience includes: High volume manufacturing, process and equipment development, process and equipment transfer from U.S. to overseas plants, training and certification, yield improvements, cost improvements, technology development. Set up manufacturing plants in United States, Malaysia, Manila and Puerto Rico.
JOHN T. MACKAY
Founder and VP Engineering, Semi-Pac Inc.
Twenty Four years experience in Semiconductor Packaging. Main duties include process development and automation.
Previous Process Engineering positions at Digital Equipment Corporation, Triliogy Systems, Storage Technology.
Work experience includes: wafer level packaging, wafer bumping, Lead free assembly, wafer sawing, dicing, wire bonding ceramic packaging, process development stencil printing, medical package development, wafer level burn in testing.
U.S. Patent for High Power Solder Die Attach.
Assignment to Intel Corp.
6 U.S. Patents for Ultra Fine Pitch Solder Deposition.
Assignment Spheretek LLC.
Assignment Fujitsu