SEMI-PAC INC.
WAFER SAWING PROJECTS
SEMI-PAC INC. OFFERS ADVANCED 300 MM WAFER SAWING SERVICE IN SUNNYVALE CALIFORNIA AND IN SINGAPORE LOCATIONS.
SEMI-PAC INC. Has provided sawing solutions to some of the most demanding programs and materials in the semiconductor industry.
Only Semi-Pac was qualified out of many subcontractors to cut exotic material for Hughes Space Systems.
This attention to quality and focus on your projects specific requirements has made Semi-Pac an industry leader.
Semi-Pac produced dicing process for Medical blood detection system required ultra clean Bio contamination:
Semi-Pac Achieved the smallest kerf width and best bio contamination of all vendors for indwelling Sensor Chips:
Semi-Pac had best yields on Motorola / Alien Technology Smart Card RFID Tag Chips:
Semi-Pac Achieved best Solar Cell Efficiency with excellent kerf edge control ( Lowest Recombination Sites )
ISO 9000- 2001 certified - Clean well Equipped Facility
Contact Semi-Pac with your dicing requirements
John Mackay V.P. Engineering
Tom Molinaro Head of Manufacturing Services
1206 F Mountain View Alviso Rd.
Sunnyvale, Ca 94089
408 734-3832 Phone
408 734-9217 Fax
Semipac@aol email
