SEMI-PAC INC.

TOM MOLINARO

Tom Molinaro

Chief Technology Officer

408 734-3832 semipac@aol.com

Semi-Pac Incorporated

Chief Technology Officer / Founder

Semi-Pac is a global semiconductor engineering and packaging company with head quarters in Silicon Valley, California and a production facility in Singapore. Mr. Molinaro and his partner John Mackay founded Semi-Pac in 1988 to address the demand for packing engineering and research and development. Molinaro has deep technical knowledge of the process and equipment used in integrated circuit fabrication and packaging. Molinaro’s expertise has allowed him to make valuable contributions to the fab and packaging process. These innovations include process and device improvements on many high profile projects commercial and military. Molinaro,s experience includes high volume equipment development and installtion in volume manufacturing lines all around the world. Molinaro has led the manufacturing at Semi-Pac for 20 plus years providing advanced
packaging for Semiconductor FABS to improve and maintain quality and life expectance of the products they produce. Molinaro developed assembly methods and materials to withstand the demanding enviornment of accelerated life testing above 350 DEG C for 1000 plus hours.

Molinaro has extensive semiconductor knowledge with a deep understanding of the quality and specifications for military and high reliability applications. This knowledge base allowed Molinaro to be a major contributer to the technology used in part of a USA DoD contract for HELFIRE and TRIDENT missile devices.

Molinaro has consistently delivered world-class solutions to the largest and the most innovative companies in the semiconductor marketplace:

               AMD
               Alien Technology
               Bectal Nevada
               Chartered Semiconductor
               Chip Express
               Intel
               Keimar
               Lawrence Livermore National Laboratory
               Lockheed Martin
               Maxim
               Motorola
               Nanogen
               NASA Ames Research Center
               Novellus
               Philips NXP
               Sandia National Laboratories
               Silterra
               Stanford Research International
               Sun Power

INTEL CORP

Molinaro Led qualification programs to evaluate and install new equipment systems in high volume semiconductor assembly facilities in Malaysia and the Philippines. This facility were extremely high volume, producing multiple millions of semiconductors per week. This required very high levels of performance of any new equipment as yields and uptime performance are greatly magnified at large volumes.

DATA LINEAR CORP

Molinaro installed and managed entire assembly facility for Trident nuclear Missile guidance system. Molinaro also managed qualifications and Navel Ordnance Documents for the final product acceptance. Molinaro hired and managed staff for multi shift operation of ongoing manufacturing.

PRECISION MONOLITHICS INC.

Molinaro managed installtion and setup of high volume advanced reliability component assembly manufacturing line for space level products in Puerto Rico. Molinaro managed large work force to qualify and operate facility.
The line installtion and operational qualification was completed under budget and ahead of the required schedule.

DIGITAL EQUIPMENT

Molinaro setup manufacturing equipment and maitained Digital's leadership by pioneering many advancements in equipment with major semiconductor equipment companies. Molinaro was responsible for the quality manufacturing of Semiconductors that DEC produced on it's internal manufacturing lines. Molinaro mastered all of the fab and packaging equipment in the facility and was responsible for introducing the first automated wafer plating and eutectic die attach system that became widely used in the industry.

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TOM MOLINARO