John T. MacKay
Chief Technology Officer
408 734-3832 semipac@aol.com
Semi-Pac Incorporated
Chief Technology Officer / Founder
Semi-Pac is a global semiconductor engineering and packaging company with head quarters in Silicon Valley, California and a production facility in Singapore. Mr. MacKay has managed the engineering divison at Semi-Pac for 20 plus years. this included packaging engineering as well as research and development on many high
profile projects. MacKay has deep technical knowledge of the process and equipment used in integrated circuit fabrication and assembly. MacKay’s expertise has allowed him to make valuable contributions to the fab and packaging process. These innovations include process & system design, equipment research and development, equipment modifications and design engineering for TAB Tape Automated Bonding, Soldering, Die Attach, interconnect design, printed cuircit design and manufacturing, electroplating, wafer sawing, wire bonding,
laser marking, wafer bumping, semiconductor package design, assembly automation, medical device development,
and volume semiconductor assembly.
MacKay invented a multichip packaging technology for Hughes Space Systems. These multichip modules were part of a USA DoD contract for the Strategic Defense Initiative [SDI]. MacKay developed the highest density wafer scale package. MacKay’s interconnect and packaging technology was so advanced that it attracted the attention of Digital Equipment Corporation who purchased the technology for the semiconductors used in the VAX 9000 series computers.
MacKay has consistently delivered world-class solutions to the largest and the most innovative companies in the semiconductor and medical marketplace including numerous Patents U.S. and Forein for our clients.
Some major clients Mackay has produced for:
Tessera
MAJOR PROJECTS:
Trilogy Systems Amdahl
MacKay was an integral part of this world-class team that created the first wafer scale super computer. MacKay was the lead packaging engineer solving serious power and thermal management issues. The Trilogy wafer scale integrated device was consuming 2kW/sq. in.! This meant MacKay had to invent a multiplicity of techniques to solve these interconnect and packaging problems. MacKay was the inventor of 3 patents for the die attach, solder bumping, power and thermal management solutions. MacKay was part of the team that transferred the technology to Digital Equipment Corporation for packaging the semiconductors used in the VAX 9000 series computers.
Motorola
MacKay consulted to engineering Smart-Card development assemble line. Motorola engineers were producing a smart card for medical data managment. MacKay was able to add significant value by improving the reliability of the final assembled cards and the overall production volume line. This improvement in reliability lead to a 600%
improvment in lifetime of the card assemblies. This packge inovation lead to the recognition from the vice presedent of Motorola.
DIGITAL EQUIPMENT
MacKay was able to design the main assembly line process and develop equipment set. This work creating some of the most advanced semiconductors that DEC would ever produce. MacKay specified and designed all of the packaging equipment in the facility. He was responsible for automated TAB assembly and bonding, Die attach,
Ultra fine line soldering, Single point laser bonding, and Rework and defective component replacement.
