SEMI-PAC INC.                     
 

I.C. ASSEMBLY PROJECTS

 Semi-Pac specializes in Quick Turn High Yield Semiconductor Assembly Applications for prototype / or production lot sizes. With over 20 years of experience in all aspects of assembly Semi-Pac can meet
your most demanding assembly requirements:


Semi-Pac offers extensive Muti-Chip Module experience with a large Military background
Semi-Pac has supplied services to DOD chip manufacturers with an excellent quality record:

 

Semi-Pac Has advanced fine pitch wire bonding capabilities and equipment and has supplied services
to many top semiconductor manufacturers maintaining an excellent quality record.




Semi-Pac has worked on projects including: Ultra low Cost Wafer Bumping, Stacked Die, Wafer Level Packaging, Advanced Multi-Chip Modules, System On A Chip, And Many Other Advanced
Semiconductor Packaging Applications. We Have the experience, Equipment, and Clean Room
Facilities to bring Value and Quality to your product or process !



Contact Semi-pac with your Assembly Requirements:
John Mackay V.P. Engineering
Tom Molinaro Head of Manufacturing Services
1206 F Mountain View Alviso Rd.
Sunnyvale, Ca 94089
408 734-3832 Phone
408 734-9217 Fax
Semipac@aol email
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