SEMI-PAC INC.
ENGINEERING SERVICES
Semi-Pac specializes in Quick Turn High Yield Semiconductor Assembly Applications for prototype / or production lot sizes. With over 20 years of experience in all aspects of assembly Semi-Pac can meet
your most demanding assembly requirements:
Semi-Pac suports it's customers with a full range of engineering services: Process development,
Packgage / substrate design, 3D modeling with finite element alyalisis, equipment or tooling
design and manufacture. You can't find a more versital team motivated to meet your projects
demands.
Semi-Pac offers extensive Muti-Chip Module experience with a large Military background
Semi-Pac has supplied services to DOD chip manufacturers with an excellent quality record:
Semi-Pac Has advanced fine pitch wire bonding capabilities and equipment and has supplied services
to many top semiconductor manufacturers maintaining an excellent quality record.
Semi-Pac has worked on projects including: Ultra low Cost Wafer Bumping, Stacked Die, Wafer Level Packaging, Advanced Multi-Chip Modules, System On A Chip, And Many Other Advanced
Semiconductor Packaging Applications. We Have the experience, Equipment, and Clean Room
Facilities to bring Value and Quality to your product or process !
Contact Semi-pac with your Engineering Requirements:
John Mackay V.P. Engineering
Tom Molinaro Head of Manufacturing Services
1206 F Mountain View Alviso Rd.
Sunnyvale, Ca 94089
408 734-3832 Phone
408 734-9217 Fax
Semipac@aol email
your most demanding assembly requirements:
Semi-Pac suports it's customers with a full range of engineering services: Process development,
Packgage / substrate design, 3D modeling with finite element alyalisis, equipment or tooling
design and manufacture. You can't find a more versital team motivated to meet your projects
demands.
Semi-Pac offers extensive Muti-Chip Module experience with a large Military background
Semi-Pac has supplied services to DOD chip manufacturers with an excellent quality record:
Semi-Pac Has advanced fine pitch wire bonding capabilities and equipment and has supplied services
to many top semiconductor manufacturers maintaining an excellent quality record.
Semi-Pac has worked on projects including: Ultra low Cost Wafer Bumping, Stacked Die, Wafer Level Packaging, Advanced Multi-Chip Modules, System On A Chip, And Many Other Advanced
Semiconductor Packaging Applications. We Have the experience, Equipment, and Clean Room
Facilities to bring Value and Quality to your product or process !
Contact Semi-pac with your Engineering Requirements:
John Mackay V.P. Engineering
Tom Molinaro Head of Manufacturing Services
1206 F Mountain View Alviso Rd.
Sunnyvale, Ca 94089
408 734-3832 Phone
408 734-9217 Fax
Semipac@aol email
