Wafer Bumping

Semi Pac Inc. offers advanced packaging services and innovative process development for your most challenging projects

experience in Medical product development

Patented Next generation ultra low cost Wafer bumping

On-site assembly service
Process Development
Reliability expertise
Patented technology
Medical compliance

Medical

Reliability Packaging

SeMi - Pac InC.

Semiconductor Packaging Excellence

Medical Devices

Space / Commercial / Medical Systems

wire bonding services wafer sawing wafer dicing service wafer scribing. PCB wire bonding printed circuit board assembly die preparation die inspection semiconductor packaging

Semi Pac Inc. has vast experience in medical

device development

Semi - Pac works with world class clients

“Semi Pac Inc. delivered everything they promised. Our customer satisfaction levels are at an all-time high!”

Semiconductor Packaging

Experts in assembly of reliability samples for quality monitoring